4 edition of Failure modes and mechanisms in electronic packages found in the catalog.
Includes bibliographical references and index.
|Statement||Chapman & Hall|
|Publishers||Chapman & Hall|
|The Physical Object|
|Pagination||xvi, 125 p. :|
|Number of Pages||77|
nodata File Size: 4MB.
Additionally, insects such as ants or mosquitos can get inside the electronics and also cause problems. This is sometimes intentionally used as a method of hardwiring connections via fuses. due to overvoltage or aging of the dielectric, occurring when breakdown voltage falls below operating voltage.
Electrical Overstress Electrical overstress, EOS, causes multiple problems, including worn relays, semiconductors and resistors.
Avoid storing or using the electronic device in high-temperature settings. Resistorswhich leads to open circuits in resistor failure modes. An occurs between the contact points electrodes both during the transition from closed to open break or from open to closed make.
The complexity of circuit boards contributes to the high number of causes of their failure. Tin whiskers may occur with lead-free soldering.
We offer on-site assessments of your facility and the equipment you have to guide you in making better purchasing decisions to improve productivity and save money. As propagation delays depend heavily on supply voltage, tolerance-bound fluctuations of the latter can trigger such behavior. EOS results in diode failure modes and problems originating in many other parts of the system. Capacitors [ ] Main article: Capacitors are characterized by theirparasitic resistance in series and parallel, and ; both parasitic parameters are often frequency- and voltage-dependent.
Ultimately, however, the PCB will not last as long with such poor construction. Electric Contacts Handbook 3rd ed. Mechanical stresses, high currents, and corrosive environments forming of and short circuits. Additionally, avoiding using the electronics in a location that experiences high temperatures can prevent thermal stress from the environment.
Formation of cracks and intermetallic growth in die attachments may lead to formation of voids and delamination, impairing heat transfer from the chip die to the substrate and heatsink and causing a thermal failure. When closed, these then show unacceptably high resistance; they may also migrate and cause shorts.